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Bluetooth Class2 Full Module
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This compact Bluetooth™ class2 full module is realized by apm`s IPD technology. It combines a 2.4 GHz ra dio processor and flash memory/EEPROM into a single LGA module with a small form factor
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Bluetooth Class2 Full Module
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This compact Bluetooth™ class2 full module is realized by apm`s IPD technology. It combines a 2.4 GHz ra dio processor and flash memory/EEPROM into a single LGA module with a small form factor
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WLAN 802.11b/g frontend module
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This is a small-form-factor, highly integrated RF front-end module designed for WLAN applications in the 2.4GHz ISM band. The RF front-end integrates a high-performance power amplifier, power detecto
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WLAN 802.11b/g frontend module
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This is a small-form-factor, highly integrated RF front-end module designed for WLAN applications in the 2.4GHz ISM band. The RF front-end integrates a high-performance power amplifier, power detecto
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WLAN 802.11b/g single module
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The module design will support SDIO and CF+ interfaces. The module enables next generation cellphones, PDAs, notebooks, home media devices, etc. to access the Internet, email, corporate networks, rec
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WLAN 802.11b/g single module
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The module design will support SDIO and CF+ interfaces. The module enables next generation cellphones, PDAs, notebooks, home media devices, etc. to access the Internet, email, corporate networks, rec
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Pressure Sensor
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DESCRIPTION The ATP pressure sensor features a micro-machined silicon solid-state sensor. All parts in this series are uncompensated high-performance die mounted on a SO-8 / DIP-6/ TO-5 packages. Pin
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Pressure Sensor
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DESCRIPTION The ATP pressure sensor features a micro-machined silicon solid-state sensor. All parts in this series are uncompensated high-performance die mounted on a SO-8 / DIP-6/ TO-5 packages. Pin
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Pressure Sensor
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DESCRIPTION The ATP pressure sensor features a micro-machined silicon solid-state sensor. All parts in this series are uncompensated high-performance die mounted on a SO-8 / DIP-6/ TO-5 packages. Pin
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