Bluetooth Class2 Full Module

This compact Bluetooth™ class2 full module is realized by apm`s IPD technology. It combines a 2.4 GHz ra dio processor and flash memory/EEPROM into a single LGA module with a small form factor of 7mm by 7mm. Except crystal, most components have been integrated in the compact Bluetooth module, which therefore can be easily embedded into portable systems for high performance Bluetooth communication. Small form factor module. 36-pin LGA package with a tiny size of 7mm by 7mm. Low power consumption. Integrating transceiver, matching network, baseband and memory on a single module. On-chip VCO and PLL provide multiple reference clock frequencies for GSM/GPRS and CDMA cellular applications. Fully compliant with Bluetooth specification V1.2. Support UART and USB 2.0 interfaces. PCM audio CODEC interface supports both master and slave mode operation.

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Bluetooth Class2 Full Module
	This compact Bluetooth™ class2 full module is realized by apm`s IPD technology. It combines a 2.4 GHz ra dio processor and flash memory/EEPROM into a single LGA module with a small form factor

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WLAN 802.11b/g frontend module
	This is a small-form-factor, highly integrated RF front-end module designed for WLAN applications in the 2.4GHz ISM band. The RF front-end integrates a high-performance power amplifier, power detecto

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	DESCRIPTION The ATP pressure sensor features a micro-machined silicon solid-state sensor. All parts in this series are uncompensated high-performance die mounted on a SO-8 / DIP-6/ TO-5 packages. Pin

Pressure Sensor
	DESCRIPTION The ATP pressure sensor features a micro-machined silicon solid-state sensor. All parts in this series are uncompensated high-performance die mounted on a SO-8 / DIP-6/ TO-5 packages. Pin

Pressure Sensor
	DESCRIPTION The ATP pressure sensor features a micro-machined silicon solid-state sensor. All parts in this series are uncompensated high-performance die mounted on a SO-8 / DIP-6/ TO-5 packages. Pin

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