 |
 |
 |
Description |
 |
|
|
|
|
|
low-k technology
1. Motive of low-k materials,,2. Kinds of low-k materials,,3. Mechanism of low-k materials,,4. Study on porous SiO2 (Sol-gel),,5. Integration between low-k and Cu,,6. Conclusion
Add to Basket
Web address
|
|
 |
Other goods of this manufacturer : |
 |
|
|
low-k technology
|
|
1. Motive of low-k materials,,2. Kinds of low-k materials,,3. Mechanism of low-k materials,,4. Study on porous SiO2 (Sol-gel),,5. Integration between low-k and Cu,,6. Conclusion
|
| |
metalllization technology
|
|
1.Conductor Systems In Metallization,,2.Silicidation,,3.Diffusion Barrier,,4.Ai Interconnection,,5.Cu Interconnection,,6.Summary
|
| |
metalllization technology
|
|
1.Conductor Systems In Metallization,,2.Silicidation,,3.Diffusion Barrier,,4.Ai Interconnection,,5.Cu Interconnection,,6.Summary
|
|
|
metalllization technology
|
|
1.Conductor Systems In Metallization,,2.Silicidation,,3.Diffusion Barrier,,4.Ai Interconnection,,5.Cu Interconnection,,6.Summary
|
| |
MOSFET advanced
|
|
1.MOSFET scaling, ,,2. MOSFET I-V characteristics, ,,3. Short-channel effects and threshold voltage design
|
| |
MOSFET advanced
|
|
1.MOSFET scaling, ,,2. MOSFET I-V characteristics, ,,3. Short-channel effects and threshold voltage design
|
|
|
MOSFET advanced
|
|
1.MOSFET scaling, ,,2. MOSFET I-V characteristics, ,,3. Short-channel effects and threshold voltage design
|
| |
MSA
|
|
1. t R P t O 2. t R 3. t s 4. t p 5. t R k E p E p 6. W w q 7.Gauge R&R e u @ 8. p p 9. p
|
| |
|
|
|
Likewise in category "Other Services": |
|
|
|
|
|
|
|
|
|
 |
 |