| |
Silikon-Epitaxial-Wafer ohne Buried Layer
|
|
3``, 4``, 5``und 6``Silikon-Epitaxial-Wafer ohne Buried Layer () Single-Layer: N / N +, P / P +, P / N +, N / P +, N / N + + () Multi-Layer: N / P / P +, P / P / P +, P / N / N +, N / N / N +, N / N
|
| |
Bipolar-IC-Foundry
|
|
Material: 5``Silizium-Wafer zu widerstehen () 5 um, 1.5um DM-Technologie () Einzel / Doppel Buried-Layer () Junction Isolation () NPN, LPNP, VPNP, Zenerdiode () Planarization: Etch-back () BVceo: 5 ~
|
|