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1. Motive of low-k materials,,2. Kinds of low-k materials,,3. Mechanism of low-k materials,,4. Study on porous SiO2 (Sol-gel),,5. Integration between low-k and Cu,,6. Conclusion
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metalllization технологий
1.Conductor Systems In Metallization,,2.Silicidation,,3.Diffusion Barrier,,4.Ai Interconnection,,5.Cu Interconnection,,6.Summary
metalllization технологий
1.Conductor Systems In Metallization,,2.Silicidation,,3.Diffusion Barrier,,4.Ai Interconnection,,5.Cu Interconnection,,6.Summary
metalllization технологий
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1.MOSFET scaling, ,,2. MOSFET I-V characteristics, ,,3. Short-channel effects and threshold voltage design
Передовые MOSFET
1.MOSFET scaling, ,,2. MOSFET I-V characteristics, ,,3. Short-channel effects and threshold voltage design
Передовые MOSFET
1.MOSFET scaling, ,,2. MOSFET I-V characteristics, ,,3. Short-channel effects and threshold voltage design
MSA
1. t R P t O 2. t R 3. t s 4. t p 5. t R k E p E p 6. W w q 7.Gauge R&R e u @ 8. p p 9. p
OJT
. z POJT G. x D T. p n u @ |. p n u @ . p OJT .OJT