#SG Resists heat,cold and water.Non-toxicity.High effect with a small amount. Excellent stability against shearing force andionizing radiation and have good water repellency,insulation properties. Fo

#3266 Temp.:-60ºC~+260ºC Gap Filling:

#CG-5 Semi-dry,high-viscous paste,excellent cohesion,bast vibration-resistance. For sealing/cohesion metal,concrete Ketc.regid materials. #735D Non-sag.Usable under water.Flexible.Resists temp.from -

#703 Medium-viscosity.Sealing/bonding,fast dry. For bonding of ABS,PS,AS. #705 No toxicity.Non-corrosive bonding.The concentration and color are adjustable. For bonding of polystyrene foam,paper and

RF-01 Solvent-base adhesive used hardener. Light brown liquid. Improve thermal and water resistance. Mix with PU adhesive or coating can improve bonding strength and film properties. TM Solvent-base

#Th-100 Two-parts,flowable,thermal conductive glue.High electrical conductive resistance. Thermal conductive potting,filling and bonding. #Th-24 Paste,one-part,thermal conductive glue,High Electrical

#A-100 Working time:7days./100g 30000~50000cps/25 Curing time: 30min.(90 ) / 4min.(150 ) High hardness.Excellent resistance to acid,alkali,solvents and heat. Heat required for cure. For bonding requ

#1051 Working time:180min./100g 3500cps/25 Curing time:11hr(100 ) / 5min.(150 ) Resists to high-voltage and heat. Excellent electrical charactericals.Heat required for cure. Especially for electrica

#927-24 Working time:24hrs./100g 2500cps/25 Curing time:50hrs.. Peak exothermic temp.40 . Long geling time.no-shrinking,self-level .Instrous surface. Can cures well,under the water or wet surface.