E-206 for soldering tin-plated wire, colored thread and others()EH-400 for soldering enamelled wire, colored thread and others()After soldering, no need to clean or passed electric tests()After solde

Flux inhibitor FI-20 possess the ability to keep flux from spreading which could make the back-surface of main board occurred default soldered.

EF-series for soldering mainboards & electronic parts()After soldering, didn`t need to clean parts and pass electronic tests()After soldering, parts are clean, good for lowering costs()Bridge & false

Producing tin-plated copper wire which has over 3 ?g alloy layer. ()Those wires would be reproduced t,o the conductive wire of capacitors.()Those wires would be reproduced to the conductive wire of r

E-series used for the soldering of main board and electronic parts. ()After soldered, parts need clean by water (supersonic wave operation)()E-series contains high actived agent, results of soldering

Flux A-100 were used in the soldering of #304, # 301 and nickel() A-100 consisted of high concentration and high active compounds() A-110 suitable for the soldering of aluminum and its alloys() Succe

Flux CL-series are used in producing tin-plated copper wire()Tin-plated wire would be reproduced to ,telecommunication cable()Tin-plated wire can be reproduced to electronic and computer cable()The f