Specification:·Material type: FR-4·Layout: 10 layers·Board thickness: 2.0mm·Surface finish: HAL lead-free·Line width: 6mil·Line space: 6mil·Solder mask color: green·Special feature: BGA and im

Specification:· Material type: FR4· Layout:6 layers· Board thickness: 1.6mm· Surface finish: lead-free HAL+ immersion gold· Min through hole: 0.1mm· Min line width: 3mil· Min line space: 4mil·

Specification:· Material type: FR4· Layout:6 layers· Board thickness: 1.6mm· Surface finish: lead-free HAL+ immersion gold· Min through hole: 0.1mm· Min line

Specification:· Aluminium Base PCB· Layer count: 1/2· Copper Thickness: H/1/2· Application: LED, Lighting· Surface finish: OSP/ENIG/HASL

Specification:·Flexible foldaway space-savingand light-weight design·Layout: 3·Base materials: 0.5oz CU, 1 mil PIand 1 mil ADH·Surface finish: immersion gold·Silkscr