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Packaging Services
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IC Packaging Services OSE offers IC package design and fabricates a full array of packages, with pin counts from 8 to more than 830. We also offer comprehensive IC testing capabilities that verify f
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Testing system
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Besides a variety of packaging services, OSE also offers comprehensive IC testing capabilities that verify function availability of logic, memory, analog, mixed signal and RF devices for customers.
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Testing system
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Besides a variety of packaging services, OSE also offers comprehensive IC testing capabilities that verify function availability of logic, memory, analog, mixed signal and RF devices for customers.
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Testing system
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Besides a variety of packaging services, OSE also offers comprehensive IC testing capabilities that verify function availability of logic, memory, analog, mixed signal and RF devices for customers.
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Manufacturing Technology
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Combined IC packaging and PCB assembly technologies Specific testing service tailored for customers (AOI, ATE / ICT) Flexible PCB assembly, thin PCB assembly No-clean and aqueous cleaning processes L
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Manufacturing Technology
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Combined IC packaging and PCB assembly technologies Specific testing service tailored for customers (AOI, ATE / ICT) Flexible PCB assembly, thin PCB assembly No-clean and aqueous cleaning processes L
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Manufacturing Technology
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Combined IC packaging and PCB assembly technologies Specific testing service tailored for customers (AOI, ATE / ICT) Flexible PCB assembly, thin PCB assembly No-clean and aqueous cleaning processes L
|
| |
Packaging Services
|
|
IC Packaging Services OSE offers IC package design and fabricates a full array of packages, with pin counts from 8 to more than 830. We also offer comprehensive IC testing capabilities that verify f
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| |