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Solvent Base Adhesives
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#CG-5 Semi-dry,high-viscous paste,excellent cohesion,bast vibration-resistance. For sealing/cohesion metal,concrete Ketc.regid materials. #735D Non-sag.Usable under water.Flexible.Resists temp.from -
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Solvent Base Adhesives
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#703 Medium-viscosity.Sealing/bonding,fast dry. For bonding of ABS,PS,AS. #705 No toxicity.Non-corrosive bonding.The concentration and color are adjustable. For bonding of polystyrene foam,paper and
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Solvent Base Harder
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RF-01 Solvent-base adhesive used hardener. Light brown liquid. Improve thermal and water resistance. Mix with PU adhesive or coating can improve bonding strength and film properties. TM Solvent-base
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Thermal conductive glue
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#Th-100 Two-parts,flowable,thermal conductive glue.High electrical conductive resistance. Thermal conductive potting,filling and bonding. #Th-24 Paste,one-part,thermal conductive glue,High Electrical
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Two-components Epoxy Adhesives
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#A-100 Working time:7days./100g 30000~50000cps/25 Curing time: 30min.(90 ) / 4min.(150 ) High hardness.Excellent resistance to acid,alkali,solvents and heat. Heat required for cure. For bonding requ
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Two-components Epoxy Adhesives
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#1051 Working time:180min./100g 3500cps/25 Curing time:11hr(100 ) / 5min.(150 ) Resists to high-voltage and heat. Excellent electrical charactericals.Heat required for cure. Especially for electrica
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Two-components Epoxy Adhesives
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#927-24 Working time:24hrs./100g 2500cps/25 Curing time:50hrs.. Peak exothermic temp.40 . Long geling time.no-shrinking,self-level .Instrous surface. Can cures well,under the water or wet surface.
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Two-components Epoxy Adhesives (#908)
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#908 Working time:30min./100g 4000cps/25 Curing time:3hrs. Fast cure.High hardness.High physical strength.Excellent resistance to acid,alkali,pressure and bending. For coating resistance to acid/alk
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Two-components Epoxy Adhesives (#931)
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#931 Working time:9min./100g 6500cps/25 Curing time:40min.. Fast cure.Excellent resistance to water,solvents and heat. For bonding/sealing on low-temp wet surfaces,and places requiring chemical-resi
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