Thickness: 6L: 39.4 mil Line width: 4 mil Line space: 4 mil Minimum hole: 8mm (finished) Minimum land diameter: 6mm Minimum SMT pitch: 16mm Working size: 500 x 600mm (maximum) Gold plating: electric
*Multilayer high density various material PCBs *Material: FR-4 or CEM-3,0.5 to 3oz copper, 3.2mm thickness *Minimum line width and line spacing: 4mm/4mm *Minimum hole diameter: 0.2mm *Max panel size:
*Multilayer: 4 to 12 layers high-density various material PCBs *Material: FR-4, 0.5 to 3oz copper, 0.15 to 3.2mm thickness *Minimum line width and line spacing: 4mm *Minimum hole diameter: 0.2mm *Max
*Multilayer high density various material PCBs *Material: FR-4 or CEM-3,0.5 to 3oz copper, 3.2mm thickness *Minimum line width and line spacing: 4mm/4mm *Minimum hole diameter: 0.2mm *Max panel size:
*Multilayer: 4 to 12 layers high-density various material PCBs *Material: FR-4, 0.5 to 3oz copper, 0.15 to 3.2mm thickness *Minimum line width and line spacing: 4mm *Minimum hole diameter: 0.2mm *Max
*Multilayer: 4 to 12 layers high-density various material PCBs *Material: FR-4, 0.5 to 3oz copper, 0.15 to 3.2mm thickness *Minimum line width and line spacing: 4mm *Minimum hole diameter: 0.2mm *Max
*Multilayer high density various material PCBs *Material: FR-4 or CEM-3,0.5 to 3oz copper, 3.2mm thickness *Minimum line width and line spacing: 4mm/4mm *Minimum hole diameter: 0.2mm *Max panel size:
help
Add to favorite
Favorite products
