Adresse: Lingbei 4th Road 16#, Fenghuang 1st Industrial Area, Fuyong Town, Bao`an District, Shenzhen City, 518103 China
Telefon: +86-0755-33515162
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PopwinTech provide several kinds of high density PCBA especially in electronic products, PCBA semi-finished products and other PCBAs. The PCBA workshop of PopwinTech's SMT pick and place chips more than 6 million point a day; AI DIP more than 2 million pieces a day; Four lines of manual placement; Five lines of testing; Three lines of assembly. These production lines can meet the machining and assembly of various kinds of home appliance, communication products, PC products. rena popwintech.com Technology Ability:Our Pick and Place machine can assemble fine pitch chips such as 0201 size chip; Multi-functional machine can match 0.3 pitch packages such as QFP, BGA, uBGA, CSP and so on; DIP can match the assembly of standing and lying parts and jumper. To cater for the internationalization tendency, lead-free reflow solder machine and wave solder machine have been introduced to our company in 2000, meanwhile, we have put efforts on the research to the lead-free solder tin and reflow curve and wave flow. Now we have abundant practical experience on manufacture electronic products.
Popwin Technology Corporation Ltd. is a professional manufacturer of PCB up to 12 Layers, we can fulfill your demand by supplying various kinds of PCB and provide PCB (OEM) Assembly service to custome
Popwin Technology Corporation Ltd. is a professional manufacturer of PCB up to 12 Layers, we can fulfill your demand by supplying various kinds of PCB and provide PCB (OEM) Assembly service to custome
rena popwintech.com Cell Phone FPC Specifications:A) Cell phone FPCB) Material: PolyimideC) Finish: OSPD) Min. Line width and spacing: 0.1mm
PopwinTech provide several kinds of high density PCBA especially in electronic products, PCBA semi-finished products and other PCBAs.rena popwintech.com We have SMT, THT, full product assembly\te
This Medical Imaging board for a medical device that is eighteen layers and presents difficult registration due to the number of layers and board's dimensions.rena popwintech.com Application:
This Medical Rigid-Flex FPC illustrates how designers use flex to reduce board thickness as well as package size and weight, and incorporate connectors into the bare board design.rena popwintech.com&n
Mobile Phone FPCrena popwintech.com 1. Camera module (BGA) uses cover layer production process to replace solder mask ink production process, improving work efficiency, shortening production proc
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