A. Metal Deposition:,,B. Dielectric Deposition:,,C. Si Epitaxy:

A. Metal Deposition:,,B. Dielectric Deposition:,,C. Si Epitaxy:

1. B 2. A z H 3. W 4. z T [ N 5. z k 6. ~ [ D _ 7. G ~ [ 8. T ~ [ 9.

D w q G p o { D P i D N T M D K j B J n | b D R 8D ` N p 8D Report C Q & A

A. Principles of Plasma Generation, ,,B. Principles of Collisions,,C. Plasma Potential and Sheath,,D. RF Plasma and Self-bias,,E. Debye Shielding,,F. Plasma Oscillation,,G. Effect of Magnetic Field o

A. Principles of Plasma Generation, ,,B. Principles of Collisions,,C. Plasma Potential and Sheath,,D. RF Plasma and Self-bias,,E. Debye Shielding,,F. Plasma Oscillation,,G. Effect of Magnetic Field o

A. Principles of Plasma Generation, ,,B. Principles of Collisions,,C. Plasma Potential and Sheath,,D. RF Plasma and Self-bias,,E. Debye Shielding,,F. Plasma Oscillation,,G. Effect of Magnetic Field o

O H G [ t T z O H | F ] P B z A C p H K p H E p

1.Introduction of Cu/Low-k Interconnects ,,2.Copper Deposition , ,,3.Diffusion Barriers for Cu ,,4.Reliability Issues In Cu Metallization