#737 Oxime cure,Non-slumping paste.Excellent sealing/bonding effect.Weatherproof. For sealing/bonding for all kinds of materials.Can bond to PC board and ABS. #739 Acetoxy cure. Non-slumping paste.Go

#503 Acetoxy cure.Red.High temperature resistant type(up to 315 ). Tough.Excellent durability and resistance to vibration. For gesketing in appliance,electrical insulation,and high-temp. spacer. #740

#343 Oxime cure.Weatherproof.Excellent resistance to temp. from -40 to +180 . Extension/compression capability up to 50%.Fireproof.UL approved. For sealing/repairing of curtain walls,building joints

#SG Resists heat,cold and water.Non-toxicity.High effect with a small amount. Excellent stability against shearing force andionizing radiation and have good water repellency,insulation properties. Fo

#3266 Temp.:-60ºC~+260ºC Gap Filling:

#CG-5 Semi-dry,high-viscous paste,excellent cohesion,bast vibration-resistance. For sealing/cohesion metal,concrete Ketc.regid materials. #735D Non-sag.Usable under water.Flexible.Resists temp.from -

#703 Medium-viscosity.Sealing/bonding,fast dry. For bonding of ABS,PS,AS. #705 No toxicity.Non-corrosive bonding.The concentration and color are adjustable. For bonding of polystyrene foam,paper and

RF-01 Solvent-base adhesive used hardener. Light brown liquid. Improve thermal and water resistance. Mix with PU adhesive or coating can improve bonding strength and film properties. TM Solvent-base

#Th-100 Two-parts,flowable,thermal conductive glue.High electrical conductive resistance. Thermal conductive potting,filling and bonding. #Th-24 Paste,one-part,thermal conductive glue,High Electrical