NoteBook DRAM Module

Apacer DDR333 512MB Micro DIMM adopts the original chip of the DDR333 32Mx8 FBGA package chip for the manufacture. Besides leading the industry to have breakthroughs in the area of capacity, speed, and volume, Apacer also adopts the FBGA packaging technology to greatly lower the chance of having an oxidation at the soldering points, and optimize the connectivity between the memory IC and the PCB, and it has an excellent heat dispersion effects to assure the reliability of high performance BGA has a faster heat dissipation rate compared to TSOP, which leads to improved reliability after extended running. BGA features a packaging signal trace length that is only 25% that of TSOP, which reduces noise and cross talk and improves electrical performance. This technique enables Apacer to offer its customers higher-quality memory modules at cost-effective solution..

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