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Multi layer PCB, 6 layers
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Layer count: 6 Minimum line width/space: 6.4/6.4mil Minimum hole size: 0.4mm Board thickness: 1.6mm Surface finish: HAL Base laminate material: FR4 Aspect ratio: 4 Impedance control: 50 ohms +/- 10%
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Multi layer PCB, 8 layers
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Layer count: 8 Minimum line width/space: 3.2, 3.2mm Minimum hole size: 0.3mm Board thickness: 1.6mm Surface finish: HAL Base laminate material: FR4 Aspect ratio: 5.3 BGA pad
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Multi Layer PCB, layer 4
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Layer count: 4 Minimum line width/space: 6.4/6.4 mil Minimum hole size: 0.3mm Board thickness: 0.8mm Base laminate material: FR4 Aspect ratio: 2.67 Surface finish: ENTEK/OSP
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Multi-layer PCB, 4 layers
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Layer count: 4 Minimum line width/space: 4/4mil Minimum hole size: 0.2mm Board thickness: 0.8mm Surface finish: electroless silver; 2 microinches Base laminate material: FR4 Aspect ratio: 4 Blind hol
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Multil Layer PCB, 4 layers
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Layer count: 4 Minimum line width/space: 4.5/4.5mil Minimum hole size: 0.25mm Board thickness: 0.5mm Surface finish: electroless silver; 2 microinches Base laminate material: FR4 Aspect ratio: 2
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Double sided PCB
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Layer count: 2 Minimum line width/space: 9.6/9.6mil Minimum hole size: 0.7mm Board thickness: 1.2mm Surface finish: gold plated; microinches Base laminate material: FR4 Aspect ratio: 1.7
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Double sided PCB
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Layer count: 2 Minimum line width/space: 9.6/9.6 mil Minimum hole size: 0.6mm Board thickness: 1.6mm Surface finish: HAL Base laminate material: FR4 Aspect ratio: 2.7
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Double sided PCB
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Layer count: 2 Minimum line width/space: 4.8/4.8mil Minimum hole size: 0.4mm Board thickness: 0.6mm Surface finish: OSP + carbon proces Base laminate material: FR4 Aspect ratio: 1.5
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Double sided PCB
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Layer count: 2 Minimum line width/space: 8/8mil Minimum hole size: 0.3mm Board thickness: 1.6mm Surface finish: electroless silver; 2 microinches Base laminate material: FR4 Aspect ratio: 5.3
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