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Multi layer PCB, 4 layers
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Layer count: 4 Minimum line width/space: 4.5/4.5mil Minimum hole size: 0.254mm Board thickness: 1.0mm Surface finish: HAL + golden finger, 30 microinches Base laminate material: FR4 Aspect ratio: 4 I
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Multi layer PCB, 4 layers
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Layer count: 4 Minimum line width/space: 4.5/4.5mil Minimum hole size: 0.3mm Board thickness: 1.6mm Surface finish: HAL Base laminate material: FR4 Aspect ratio: 5.3
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Multi layer PCB, 4 layers
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Layer count: 4 Minimum line width/space: 4/4 mil Minimum hole size: 0.2mm Board thickness: 0.8mm Surface finish: electroless silver; 2 microinches Base laminate material: FR4 Aspect ratio: 4 Blind ho
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Multi layer PCB, 4 layers
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Layer count: 4 Minimum line width/space: 6.4/6.4mil Minimum hole size: 0.2mm Board thickness: 0.8mm Surface finish: electroless silver + golden finger, 30 microinches Base laminate material: FR4 Aspe
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Multi Layer PCB, 4 layers
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Layer count: 4 Minimum line width/space: 8/8mil Minimum hole size: 0.6mm Board thickness: 1.6mm Surface finish: electroless silver; 2 microinches Base laminate material: FR4 Aspect ratio: 2.7
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Multi layer PCB, 4 layers
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Layer count: 4 Minimum line width/space: 6.4/6.4 mil Minimum hole size: 0.4mm Board thickness: 1mm Surface finish: HAL Base laminate material: FR4 Aspect ratio: 2.5
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Multi layer PCB, 6 layers
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Layer count: 6 Minimum line width/space: 6.4/6.4mil Minimum hole size: 0.4mm Board thickness: 1.6mm Surface finish: HAL Base laminate material: FR4 Aspect ratio: 4 Impedance control: 50 ohms +/- 10%
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Multi layer PCB, 8 layers
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Layer count: 8 Minimum line width/space: 3.2, 3.2mm Minimum hole size: 0.3mm Board thickness: 1.6mm Surface finish: HAL Base laminate material: FR4 Aspect ratio: 5.3 BGA pad
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Multi Layer PCB, layer 4
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Layer count: 4 Minimum line width/space: 6.4/6.4 mil Minimum hole size: 0.3mm Board thickness: 0.8mm Base laminate material: FR4 Aspect ratio: 2.67 Surface finish: ENTEK/OSP
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