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Double sided PCB
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Layer count: 2 Minimum line width/space: 4.8/4.8mil Minimum hole size: 0.4mm Board thickness: 0.6mm Surface finish: OSP + carbon proces Base laminate material: FR4 Aspect ratio: 1.5
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Double sided PCB
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Layer count: 2 Minimum line width/space: 8/8mil Minimum hole size: 0.3mm Board thickness: 1.6mm Surface finish: electroless silver; 2 microinches Base laminate material: FR4 Aspect ratio: 5.3
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Double sided PCB
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Layer count: 2 Minimum line width/space: 9.6/9.6 mil Minimum hole size: 0.9mm Board thickness: 1mm Surface finish: gold plated; 2 microinches Base laminate material: FR4 Aspect ratio: 1.1
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Double-Sided PCB
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Layer count: 2 Minimum line width/space: 4/4 mil Minimum hole size: 0.254mm Board thickness: 0.6mm Surface finish: electroless silver, 3 microinches Base laminate material: FR4 Aspect ratio: 3.15
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Multi layer PCB, 4 layer
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Layer count: 4 Minimum line width/space: 4, 4mm Minimum hole size: 0.3mm Board thickness: 0.4mm Surface finish: electroless silver; 2 microinches Base laminate material: FR4 Aspect ratio: 1.3
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Multi layer PCB, 4 layers
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Layer count: 4 Minimum line width/space: 6.32/6.32 mil Minimum hole size: 0.4mm Board thickness: 1.6mm Surface finish: HAL Base laminate material: FR4 Aspect ratio: 4
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Multi layer PCB, 4 layers
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Layer count: 4 Minimum line width/space: 4.7/4.7mil Minimum hole size: 0.3mm Board thickness: 1.6mm Surface finish: gold flash Base laminate material: FR4 Aspect ratio: 5.3
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Multi layer PCB, 4 layers
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Layer count: 4 Minimum line width/space: 6/6mil Minimum hole size: 0.35mm Board thickness: 0.25mm Surface finish: HAL Base laminate material: FR4 Aspect ratio: 0.7 Impedance control: 90 ohms +/- 10%
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Multi layer PCB, 4 layers
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Layer count: 4 Minimum line width/space: 4.72/4.72 mil Minimum hole size: 0.3mm Board thickness: 1.6mm Base laminate material: FR4 Aspect ratio: 5.3 Surface finish: ENTEK/OSP
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